Product Information
Featuresof TSE3281:
Excellent thermal conductivity properties
Fast thermal cure times
Excellent adhesion to many substrates without the use of aprimer
Outstanding operating temperature performance (-55°C to200°C)
One component solventless formulation for ease of handling
No cure by- products/ low shrinkage/non- exothermic allows fordeep section
Application and use in enclosed assemblies.
Reversion resistance and hydrolytically stable
Outstanding dielectric properties.
