M-Bond 610 Adhesive System Complete Kit套装

This high-performance two component epoxy-phenolic resin wasformulated specifically for bonding strain gages and temperaturesensors. When properly cured, this two part adhesive is useful fortemperatures ranging from deep cryogenic, -269° C (-452° F) (4° K)to 370° C (700° F) for short periods, and -269° C (-452° F) (4° K)to 260° C (500 °F) for long periods. Note that for transducerapplications, the recommended temperature upper limit is 230° C(450° F). Like other organic materials, the higher temperaturelifetime is limited by oxidation and sublimationeffects.这种高性能的两组分环氧酚醛树脂是专门为粘接应变计和温度传感器而配制的。如果正确固化，此两部分粘合剂可用于深低温，短期内-269°C（-452°F）（4°K）到370°C（700°F）以及-269°C的温度范围。（-452°F）（4°K）到260°C（500°F）长时间。请注意，对于传感器应用，建议的温度上限为230°C（450°F）。像其他有机材料一样，高温寿命受到氧化和升华作用的限制。

The M-bond 610 product is prepared by mixing together the twodifferent components, a "curing agent" and the other, the adhesive.Each kit contains four bottles of each of the two components, the"curing agent" coming in 11 gram bottles and the "adhesive" comingin 14 gram bottles. When used, one bottle of each component isrequired to make up a total of 25 grams of working adhesive. Atotal of 100 grams is present in each kit. In addition, each kitcontains 4 brush caps for dispensing mixed adhesives and 4disposable mixing funnels. Each kit comes with mixing instructions,surface preparation instructions, and shelf and pot lifeinformation. One should pay particularly close attention to theelongation capabilities and handling precautions.