粘合剂为电路板维修提供了极其简便的应用。 它是一种双组分体系,混合比为1:1,在室温下24小时固化。在0.75小时的高温固化温度212°F(100°C)下,该材料的体积电阻率为0.005欧姆 - 厘米。
Adhesive offers exceptional ease of application for circuitboard repair. It is a two- component system with a 1:1 mix ratio,and cures in 24 hours at room temperature. With a 0.75 hourelevated cure temperature of 212°F (100°C), the material offersvolume resistivity of 0.005 ohm-cm.