CHO-BOND®4660和4669 ONE COMPONENT FLLEXIBLE导电聚异丁烯密封剂。 CHO-BOND4660是一种镀银铜填充的单组分导电聚异丁烯。 它设计用作电气外壳上的圆角,间隙填充物和接缝密封剂,用于EMI屏蔽或电气接地。
CHO-BOND® 4660 and 4669 ONE COMPONENT FLEXIBLE ELECTRICALLYCONDUCTIVE POLYISOBUTYLENE SEALANT. CHO-BOND 4660 is asilver-plated copper filled, one-component conductivepolyisobutylene. It is designed for use as a fillet, gap filler andseam sealant on electrical enclosures for EMI shielding orelectrical grounding.